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HomeMaterials Science ForumMaterials Science Forum Vols. 347-349Computer Simulation of Residual Stress...

Computer Simulation of Residual Stress Distribution and Microcracking due to Thermal Expansion Anisotropy

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Residual Stress ECRS 5

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Periodical:

Materials Science Forum (Volumes 347-349)

Pages:

211-216

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.347-349.211

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Online since:

May 2000

Authors:

André Zimmermann, Edwin R. Fuller, Jürgen Rödel

Keywords:

Ceramic, Computer Simulation, Residual Stress, Thermal Expansion Anisotropy

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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