Computer Simulation of Residual Stress Distribution and Microcracking due to Thermal Expansion Anisotropy

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Periodical:

Materials Science Forum (Volumes 347-349)

Edited by:

A.J. Böttger, R. Delhez and E.J. Mittemeijer

Pages:

211-216

DOI:

10.4028/www.scientific.net/MSF.347-349.211

Citation:

A. Zimmermann et al., "Computer Simulation of Residual Stress Distribution and Microcracking due to Thermal Expansion Anisotropy", Materials Science Forum, Vols. 347-349, pp. 211-216, 2000

Online since:

May 2000

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$35.00

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