Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI

Abstract:

Article Preview

Info:

Periodical:

Materials Science Forum (Volumes 408-412)

Edited by:

Dong Nyung Lee

Pages:

1657-1662

Citation:

H. J. Lee and D. N. Lee, "Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI", Materials Science Forum, Vols. 408-412, pp. 1657-1662, 2002

Online since:

August 2002

Export:

Price:

$38.00

Fetching data from Crossref.
This may take some time to load.