Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI

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Periodical:

Materials Science Forum (Volumes 408-412)

Edited by:

Dong Nyung Lee

Pages:

1657-1662

DOI:

10.4028/www.scientific.net/MSF.408-412.1657

Citation:

H. J. Lee and D. N. Lee, "Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI", Materials Science Forum, Vols. 408-412, pp. 1657-1662, 2002

Online since:

August 2002

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$35.00

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