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HomeMaterials Science ForumMaterials Science Forum Vols. 408-412Effects of Current Waveform and Bath Temperature...

Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI

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Textures of Materials - ICOTOM 13

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Periodical:

Materials Science Forum (Volumes 408-412)

Pages:

1657-1662

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.408-412.1657

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Online since:

August 2002

Authors:

Hyo Jong Lee, Dong Nyung Lee

Keywords:

Copper (Cu), Pulse Plating, Surface Morphology, Texture, ULSI

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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