Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling

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Periodical:

Materials Science Forum (Volumes 408-412)

Edited by:

Dong Nyung Lee

Pages:

1651-1656

DOI:

10.4028/www.scientific.net/MSF.408-412.1651

Citation:

S. J. Hwang et al., "Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling", Materials Science Forum, Vols. 408-412, pp. 1651-1656, 2002

Online since:

August 2002

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$35.00

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