Texture Investigations In Damascene Copper Interconnects

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Periodical:

Materials Science Forum (Volumes 408-412)

Edited by:

Dong Nyung Lee

Pages:

1627-1632

Citation:

K. K. Mirpuri et al., "Texture Investigations In Damascene Copper Interconnects", Materials Science Forum, Vols. 408-412, pp. 1627-1632, 2002

Online since:

August 2002

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Price:

$38.00

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