Texture Analysis of Copper Bonding Wire

Abstract:

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Periodical:

Materials Science Forum (Volumes 408-412)

Edited by:

Dong Nyung Lee

Pages:

803-808

DOI:

10.4028/www.scientific.net/MSF.408-412.803

Citation:

S. M. Baeck et al., "Texture Analysis of Copper Bonding Wire", Materials Science Forum, Vols. 408-412, pp. 803-808, 2002

Online since:

August 2002

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Price:

$35.00

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