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HomeMaterials Science ForumMaterials Science Forum Vols. 408-412Texture Analysis of Copper Bonding Wire

Texture Analysis of Copper Bonding Wire

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Textures of Materials - ICOTOM 13

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Periodical:

Materials Science Forum (Volumes 408-412)

Pages:

803-808

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.408-412.803

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Online since:

August 2002

Authors:

Suk Min Baeck, Kwang Kyun Park, Hunphil Ha, Young Joo Oh, Yong Jin Park, Jung Tak Moon, Jin Lee, Kyu Hwan Oh

Keywords:

Copper Bonding Wire, Electron Backscatter Diffraction (EBSD), Recrystallization RX, Texture

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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