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HomeMaterials Science ForumMaterials Science Forum Vols. 414-415Investigation of Creep Microcavities by Scanning...

Investigation of Creep Microcavities by Scanning Electron Microscope

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Materials Science, Testing and Informatics I

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Periodical:

Materials Science Forum (Volumes 414-415)

Pages:

183-188

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.414-415.183

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Online since:

January 2003

Authors:

László Dévényi, Tamas Biro

Keywords:

Creep, Damage, Grain Boundary, Void Nucleation

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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