Copper Deposition and Subsequent Grain Structure Evolution in Narrow Lines

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Periodical:

Materials Science Forum (Volumes 426-432)

Main Theme:

Edited by:

T. Candra, Jose Maria Torralba and T. Sakai

Pages:

2485-2490

DOI:

10.4028/www.scientific.net/MSF.426-432.2485

Citation:

S.H. Brongersma et al., "Copper Deposition and Subsequent Grain Structure Evolution in Narrow Lines", Materials Science Forum, Vols. 426-432, pp. 2485-2490, 2003

Online since:

August 2003

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$35.00

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