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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Copper Deposition and Subsequent Grain Structure...

Copper Deposition and Subsequent Grain Structure Evolution in Narrow Lines

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

2485-2490

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.2485

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Online since:

August 2003

Authors:

S.H. Brongersma, Jan D'Haen, K. Vanstreels, W. DeCeuninck, I. Vervoort, Karen Maex

Keywords:

Copper (Cu), Grain Growth, Real-Time SEM

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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