Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines

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Periodical:

Materials Science Forum (Volumes 426-432)

Main Theme:

Edited by:

T. Candra, Jose Maria Torralba and T. Sakai

Pages:

3551-3556

DOI:

10.4028/www.scientific.net/MSF.426-432.3551

Citation:

K. K. Mirpuri et al., "Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines", Materials Science Forum, Vols. 426-432, pp. 3551-3556, 2003

Online since:

August 2003

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$35.00

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