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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Texture, Microstructure and Stress Investigations...

Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

3551-3556

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.3551

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Online since:

August 2003

Authors:

Kabir Kumar Mirpuri, Jae Young Cho, Jerzy A. Szpunar

Keywords:

Cu Damascene, Electronic Interconnect, Microstructure, Orientation Image Microscopy (OIM), Stress, Texture

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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