Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition

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Periodical:

Materials Science Forum (Volumes 426-432)

Main Theme:

Edited by:

T. Candra, Jose Maria Torralba and T. Sakai

Pages:

3715-3720

DOI:

10.4028/www.scientific.net/MSF.426-432.3715

Citation:

K.-W. Seol et al., "Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition", Materials Science Forum, Vols. 426-432, pp. 3715-3720, 2003

Online since:

August 2003

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