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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Influence of Additives upon Nucleation and Growth...

Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

3715-3720

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.3715

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Online since:

August 2003

Authors:

Kyeong-Won Seol, Byung Hak Choe, Ye Kun Lee, Jong K. Lee

Keywords:

Additive, Copper (Cu), Electro-Deposition, Electron Tunneling, Oxide, Titanium Substrate

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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