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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Modeling the Hot Flow Stress of Commercial Purity...

Modeling the Hot Flow Stress of Commercial Purity Coppers with Different Oxygen Levels

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

3921-3926

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.3921

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Online since:

August 2003

Authors:

V.G. García, Jose María Cabrera, Jose Manuel Prado

Keywords:

Apparent Activation Energy, Copper (Cu), Hot Flow Modeling, Precipitation Hardening

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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