Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure

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Periodical:

Materials Science Forum (Volumes 426-432)

Main Theme:

Edited by:

T. Candra, Jose Maria Torralba and T. Sakai

Pages:

4075-4080

DOI:

10.4028/www.scientific.net/MSF.426-432.4075

Citation:

M. I. Osendi and P. Miranzo, "Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure", Materials Science Forum, Vols. 426-432, pp. 4075-4080, 2003

Online since:

August 2003

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