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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Joining of Silicon Nitride by Interposing Metal...

Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

4075-4080

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.4075

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Online since:

August 2003

Authors:

María Isabel Osendi, Pilar Miranzo

Keywords:

Interface, Joining, Ni Base Braze, Nickel Ni, Stainless Steel (SS)

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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