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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Thermodynamic Issues of Lead-Free Soldering in...

Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging

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THERMEC'2003

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

4081-4086

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.4081

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Online since:

August 2003

Authors:

S.W. Jeong, J.H. Kim, Hyuck Mo Lee

Keywords:

Electronic Packaging, Lead-Free Solder, Solder Joint, Thermodynamic

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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