Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging

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Periodical:

Materials Science Forum (Volumes 426-432)

Main Theme:

Edited by:

T. Candra, Jose Maria Torralba and T. Sakai

Pages:

4081-4086

DOI:

10.4028/www.scientific.net/MSF.426-432.4081

Citation:

S.W. Jeong et al., "Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging", Materials Science Forum, Vols. 426-432, pp. 4081-4086, 2003

Online since:

August 2003

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$35.00

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