Effect of Heating Rate on Transient Liquid Phase Diffusion Bonding of Ni-Based Superalloy GTD-111

Abstract:

This study was carried out to investigate the effect of heating rate on dissolution and solidification behavior during transient liquid phase diffusion bonding of Ni-based superalloy GTD-111. The heating rate was varied by 0.1K/sec, 1K/sec, 10K/sec to the bonding temperatures 1373K and 1423K in vacuum. When the heating rate was slower and the bonding temperature was higher, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification was shorter. However, when the total time required for completion of solidification from the beginning of heating was considered, heating at 0.1K/sec was nearly the same as heating at 10K/sec.

• Periodical: Materials Science Forum (Volumes 449-452)
• Pages: 133-136
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.449-452.133
• Online since: March 2004
• Authors: Woo Hyuk Choi, Sung Wook Kim, Chang Hee Lee, Jung Cheol Jang
• Keywords: Dissolution, Equiaxed Ni-Based Superalloy, GTD-111, Heating Rate, Isothermal Solidification, Transient Liquid Phase Diffusion Bonding

References

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