Designing, Processing and Properties of Advanced Engineering Materials

Volumes 449-452

doi: 10.4028/www.scientific.net/MSF.449-452

Paper Title Page

Authors: Hiroyuki Muto, Mototsugu Sakai

Abstract: A novel indentation method is proposed to study the mechanical properties of porous and/or heterogeneous materials by the use of a...

857
Authors: Shigeki Morita, Toshiro Kobayashi

Abstract: Instrumented Charpy impact test method is possible to obtain various dynamic fracture characteristics from the load-deflection or load-time...

861
Authors: Hi Won Jeong, Y.S. Kim, Seung Eon Kim, Yong Taek Hyun, Yont Tai Lee, J.K. Park

Abstract: New titanium alloys with a low elastic modulus have been developed for biomedical applications to avoid the stress shielding effect of the...

865
Authors: Young Mok Rhyim, Kuk Tae Youn, Wee Do Yoo, Young Sang Na, J.H. Lee

Abstract: The influence of thermal fatigue test temperature on crack propagation behavior of the surface treated tool steel for die-casting...

869
Authors: Moo Young Huh, J.P. Lee, Jae Chun Lee, Jong Woo Park, Young Hoon Chung

Abstract: The evolution of texture and microstructure during the equal channel angular rolling (ECAR) and subsequent annealing in aluminum alloy 3003...

873
Authors: Ji Hyun Yoon, Jun Park, Soon Dong Park, Bong Sang Lee, Eui Pak Yoon

Abstract: The influence of the microstructure on the J-R ductile crack growth resistance of austenitic stainless steel AISI Type 347 welds was...

877
Authors: Do Won Seo, Ho Chel Yoon, Jin Yi Lee, Jae Kyoo Lim

Abstract: Ceramics are significantly used in many industrial applications due to their excellent mechanical and thermal properties such as high...

881
Authors: Chang Seog Kang, Sung Kil Hong

Abstract: A mechanical spectroscopy study has been made on fine-grained Ni-10vol%TZP(ZrO2-3mol.%Y2O3) composite in an attempt to assess the following...

885
Authors: H.K. Lee, Chung Yun Kang, C.S. Woo, S.H. Kim, Dae Up Kim

Abstract: Microstructures of 0.18wt% nitrogen-contained duplex stainless steel, SUS329J3L brazed in a vacuum furnace of 10-4...

889
Authors: Jeong Won Yoon, Chang Bae Lee, Seung Boo Jung

Abstract: The growth kinetics of intermetallic compound (IMC) layers formed between Sn-3.5Ag-0.75Cu BGA (ball grid array) solder and electroless...

893

Showing 211 to 220 of 328 Paper Titles