Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

Abstract:

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The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

2627-2630

DOI:

10.4028/www.scientific.net/MSF.475-479.2627

Citation:

S. T. Kim and J. Y. Huh, "Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging", Materials Science Forum, Vols. 475-479, pp. 2627-2630, 2005

Online since:

January 2005

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$35.00

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