A Bonding Map for Cu and Al Plates by Pressure Welding at Cold and Warm Temperatures

K.-S. Sim; Yong Shin Lee

doi:10.4028/www.scientific.net/MSF.475-479.2667

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Microstructural Evolution of Undercooled Ni-40wt%Pb Hypermonotectic Alloy
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Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints
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Effect of Material Properties on the Plastic Straining Capacity of Defective Welds
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Fitness-for-Purpose Assessment of Misaligned Welds
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A Bonding Map for Cu and Al Plates by Pressure Welding at Cold and Warm Temperatures
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Numerical and Experimental Study of the Electromagnetic Continuous Casting of Silicon
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Electrochemical and Optical Characterization of the Corrosion Resistivity of Explosively Bonded Al-Cu Bimetal
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Nitrogen Porosity in Nitrogen Bearing Austenitic Stainless Steel
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Rheology and Foaming Characteristics of Melt for Metal Foam
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HomeMaterials Science ForumMaterials Science Forum Vols. 475-479A Bonding Map for Cu and Al Plates by Pressure...

A Bonding Map for Cu and Al Plates by Pressure Welding at Cold and Warm Temperatures

Abstract:

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm formings such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to 200°C. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of 1MPa , is proposed in terms of welding pressure and surface roughness for the cold and warm temperature ranges.