Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints

Abstract:

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The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be concluded that temperature, as an experimental variable, is not less import than the current density in electromigration study. Experimentally, no evidence of mass transport due to thermomigration was observed.

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

2655-2658

DOI:

10.4028/www.scientific.net/MSF.475-479.2655

Citation:

Y.H. Lin et al., "Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints", Materials Science Forum, Vols. 475-479, pp. 2655-2658, 2005

Online since:

January 2005

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Price:

$35.00

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