Stabilization of Nano-Al2O3p/Cu Composite after High Temperature Annealing Treatment

Abstract:

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Al2O3 dispersion strengthened copper composite (Al2O3p/Cu composite) was produced by internal oxidation. The hardness and electrical conductivity of the produced Al2O3p/Cu composite (0.60 wt.% Al2O3) subjected to high temperature annealing treatments after different cold work deformations have been investigated; the microstructures of the composite have also been analyzed by TEM. Results show that the microstructure of the composite is characterized by an uniform distribution of nano-Al2O3 particles in Cu-matrix; the composite can maintain more than 91% hardness retention after 1h, 1000°C annealing treatment; the recrystallization of the Cu-matrix can be largely retarded and only partially happened even annealing for 1h at 1050°C, following cold deformation of 84%.

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

993-996

DOI:

10.4028/www.scientific.net/MSF.475-479.993

Citation:

K. X. Song et al., "Stabilization of Nano-Al2O3p/Cu Composite after High Temperature Annealing Treatment", Materials Science Forum, Vols. 475-479, pp. 993-996, 2005

Online since:

January 2005

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Price:

$35.00

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