Stabilization of Nano-Al2O3p/Cu Composite after High Temperature Annealing Treatment

Ke Xing Song; Ping Liu; Bao Hong Tian; Qi Ming Dong; Jian Dong Xing

doi:10.4028/www.scientific.net/MSF.475-479.993

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HomeMaterials Science ForumMaterials Science Forum Vols. 475-479Stabilization of Nano-Al2O3p/Cu Composite after...

Stabilization of Nano-Al₂O_3p/Cu Composite after High Temperature Annealing Treatment

Abstract:

Al2O3 dispersion strengthened copper composite (Al2O3p/Cu composite) was produced by internal oxidation. The hardness and electrical conductivity of the produced Al2O3p/Cu composite (0.60 wt.% Al2O3) subjected to high temperature annealing treatments after different cold work deformations have been investigated; the microstructures of the composite have also been analyzed by TEM. Results show that the microstructure of the composite is characterized by an uniform distribution of nano-Al2O3 particles in Cu-matrix; the composite can maintain more than 91% hardness retention after 1h, 1000°C annealing treatment; the recrystallization of the Cu-matrix can be largely retarded and only partially happened even annealing for 1h at 1050°C, following cold deformation of 84%.

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Materials Science Forum (Volumes 475-479)

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993-996

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https://doi.org/10.4028/www.scientific.net/MSF.475-479.993

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January 2005

Authors:

Ke Xing Song, Ping Liu, Bao Hong Tian, Qi Ming Dong, Jian Dong Xing

Keywords:

Al₂O₃ Particle, Composite, Electrical Conductivity, Hardness

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