Texture Evolution in Thin Cu Films and Lines

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Periodical:

Materials Science Forum (Volumes 495-497)

Edited by:

Paul Van Houtte and Leo Kestens

Pages:

1323-1332

DOI:

10.4028/www.scientific.net/MSF.495-497.1323

Citation:

D. P. Field et al., "Texture Evolution in Thin Cu Films and Lines", Materials Science Forum, Vols. 495-497, pp. 1323-1332, 2005

Online since:

September 2005

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$35.00

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