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HomeMaterials Science ForumMaterials Science Forum Vols. 495-497Texture Evolution in Thin Cu Films and Lines

Texture Evolution in Thin Cu Films and Lines

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Textures of Materials - ICOTOM 14

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Periodical:

Materials Science Forum (Volumes 495-497)

Pages:

1323-1332

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.495-497.1323

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Online since:

September 2005

Authors:

David P. Field, John E. Sanchez, No Jin Park, Paul R. Besser

Keywords:

Copper (Cu), Electron Backscatter Diffraction (EBSD), Grain Growth, Thin Film

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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