An Experimental Study on the Effects of Abrasive Particle Sizes on Polishing Phenomena

Abstract:

Article Preview

The effects of abrasive particle size on polishing phenomena during wafer planarization are investigated using a high precision polishing process test bench with in-situ measurement technology. The present experimental results are found to be comported with the experimental and theoretical data published previously. The current experimental outcomes can help to understand the polishing mechanism and develop the relating theoretical model.

Info:

Periodical:

Materials Science Forum (Volumes 505-507)

Edited by:

Wunyuh Jywe, Chieh-Li Chen, Kuang-Chao Fan, R.F. Fung, S.G. Hanson,Wen-Hsiang Hsieh, Chaug-Liang Hsu, You-Min Huang, Yunn-Lin Hwang, Gerd Jäger, Y.R. Jeng, Wenlung Li, Yunn-Shiuan Liao, Chien-Chang Lin, Zong-Ching Lin, Cheng-Kuo Sung and Ching-Huan Tzeng

Pages:

301-306

DOI:

10.4028/www.scientific.net/MSF.505-507.301

Citation:

Y. R. Jeng and P. Y. Huang, "An Experimental Study on the Effects of Abrasive Particle Sizes on Polishing Phenomena", Materials Science Forum, Vols. 505-507, pp. 301-306, 2006

Online since:

January 2006

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.