High Temperature Chemical Interaction Between SiO2 Substrates and Ag-Cu Based Liquid Alloys in Vacuo

Abstract:

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The interfaces formed between vitreous or thermally devitrified fused quartz substrates and silver alloys after 90 min at 850 °C in vacuum have been characterized. Three silver alloys have been used: Cusil (Ag–28 wt % Cu), Cusil-ABA (Ag–35 wt % Cu–1.5 wt % Ti), and Incusil-ABA (Ag–27 wt % Cu–12 wt % In–2 wt % Ti). A non wetting condition is found for the Cusil alloy in both substrates. In contrast, the formation of Ti5Si3, Cu3Ti3O and Ti2O3, following the sequence SiO2 → Ti2O3 → Ti5Si3 → Cu3Ti3O, is observed at the metal/ceramic interface for the two titaniumcontaining alloys on both substrates. Ti2O3 is commonly found as small particles dispersed in a silver-rich matrix. During the experiments, the reaction product layers detach from the ceramic surface and float away from the ceramic/metal interface due to their relatively low density with respect to the liquid alloy. The formation of the phases detected at the ceramic/metal interface can be explained in terms of their relative thermodynamic stability.

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Periodical:

Edited by:

H. Balmori-Ramírez, M. Brito, J.G. Cabañas-Moreno, H.A. Calderón-Benavides, K. Ishizaki and A. Salinas-Rodríguez

Pages:

117-122

DOI:

10.4028/www.scientific.net/MSF.509.117

Citation:

J. López-Cuevas et al., "High Temperature Chemical Interaction Between SiO2 Substrates and Ag-Cu Based Liquid Alloys in Vacuo", Materials Science Forum, Vol. 509, pp. 117-122, 2006

Online since:

March 2006

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Price:

$35.00

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