Surface Strengthening of Polymer Micromold Using Electroless Ni-P Deposition

Abstract:

Article Preview

In this work, we made micromolds using SU-8 photoresist and adopted electroless Ni-P deposition, well known as a hard coating material, to improve the rigidity and durability of SU-8 micromolds. After a micromold using SU-8 was defined by conventional lithography, Ni-P layer was electrolessly deposited on SU-8. By means of electroless Ni-P deposition, it was possible to increase the hardness of a micromold as much as about 17 times. In addition, it will be able to make various sized micromolds with one photomask by regulating the thickness of Ni-P layer.

Info:

Periodical:

Materials Science Forum (Volumes 510-511)

Edited by:

Hyung Sun Kim, Yu Bao Li and Soo Wohn Lee

Pages:

1138-1141

DOI:

10.4028/www.scientific.net/MSF.510-511.1138

Citation:

J. W. Choi et al., "Surface Strengthening of Polymer Micromold Using Electroless Ni-P Deposition", Materials Science Forum, Vols. 510-511, pp. 1138-1141, 2006

Online since:

March 2006

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.