Surface Strengthening of Polymer Micromold Using Electroless Ni-P Deposition

Abstract:

In this work, we made micromolds using SU-8 photoresist and adopted electroless Ni-P deposition, well known as a hard coating material, to improve the rigidity and durability of SU-8 micromolds. After a micromold using SU-8 was defined by conventional lithography, Ni-P layer was electrolessly deposited on SU-8. By means of electroless Ni-P deposition, it was possible to increase the hardness of a micromold as much as about 17 times. In addition, it will be able to make various sized micromolds with one photomask by regulating the thickness of Ni-P layer.

• Periodical: Materials Science Forum (Volumes 510-511)
• Pages: 1138-1141
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.510-511.1138
• Online since: March 2006
• Authors: Jae Woong Choi, Seok Jun Hong, Gil Ho Hwang, Sung Goon Kang
• Keywords: Electroless Ni-P Deposition, Micro Injection Moulding, Micromold, Surface Strengthening

References

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