Electrochemical and Structural Properties of Si/Ni/Cu Electrode Films Fabricated with Different Methods

Gyu Bong Cho; Bong Ki Lee; Won Chul Sin; Tae Hyun Nam

doi:10.4028/www.scientific.net/MSF.510-511.266

Paper Titles

Castability, Tensile and Creep Properties of Mg-xAl-Zn with Variation of Al Content
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Development of Manufacturing Process Using Cold Incremental Forming Technique for Micro-Alloyed Non-Heat-Treated Material
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Development of Cube-Textured Ni and Ni-W Alloy Tapes by Focused Infrared Heating
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Shape Memory Effect and Superelasticity of an Equiatomic Ti-Ni Alloy with Surface Sulfide Layers
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Electrochemical and Structural Properties of Si/Ni/Cu Electrode Films Fabricated with Different Methods
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Reciprocating Sliding Wear Behavior of Inconel 600 Mated with SUS 304 Stainless Steel at Elevated Temperatures
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The Cavitation Behavior of Fe-Cr-C-Si-Ni Alloys
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Effect of Tin on the Microstructures and Mechanical Properties of a Au-Pt-Cu Alloy
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Effect of Indium on Bonding between Porcelain and Au-Pt-Cu Alloy
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HomeMaterials Science ForumMaterials Science Forum Vols. 510-511Electrochemical and Structural Properties of...

Electrochemical and Structural Properties of Si/Ni/Cu Electrode Films Fabricated with Different Methods

Abstract:

Si film electrodes for Li micro-film batteries were fabricated on a Cu substrate and a Ni/Cu film. In the structural properties, Si film had an amorphous structure, while the crystallinity of Ni buffer film was improved after annealing. FE-SEM observation demonstrated differences in surface morphologies of Si films fabricated with different methods. In the electrochemical properties, the Ni-inserted film showed the largest initial charge and discharge capacity, and the cell with annealed Si/Ni/Cu film showed good cycleability. It is believed that the insertion of Ni film as a buffer film improved the charge and discharge capacity owing to the enhancement of adhesion between Si film and Cu substrate.