Influence of Microstructure on Electrochemical Properties of Severely Deformed Al-5 wt% Cu Alloy by ECAP

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The influence of microstructure on the electrochemical properties of an Al-5 wt% Cu binary alloy which was severely deformed by equal-channel angular pressing (ECAP) has been investigated in a borate-boric acid buffer solution containing Cl¯ ions at pH 8.3 and 25°C by potentiodynamic polarization test. The anodic polarization results showed that pitting potentials of ECAPed Al-Cu alloy samples were higher than that of the sample without ECAP and increased with repetitive ECAP passes. The pitting corrosion attack of Al-Cu alloy samples took place in the surroundings of Al2Cu (θ) phase. It is considered that the grain refinement of θ phase and the solid solution generated in Al matrix during ECAP process are responsible for the improvement of the corrosion resistance of ECAPed Al-Cu alloy.

Info:

Periodical:

Materials Science Forum (Volumes 519-521)

Edited by:

W.J. Poole, M.A. Wells and D.J. Lloyd

Pages:

705-710

DOI:

10.4028/www.scientific.net/MSF.519-521.705

Citation:

Z. G. Zhang et al., "Influence of Microstructure on Electrochemical Properties of Severely Deformed Al-5 wt% Cu Alloy by ECAP", Materials Science Forum, Vols. 519-521, pp. 705-710, 2006

Online since:

July 2006

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Price:

$35.00

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