Kinetic Features of Solid-State Reactive Diffusion between Au and Sn-Base Solder

Abstract:

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The kinetics of the solid-state reactive diffusion between Au and Sn was experimentally observed using Sn/Au/Sn diffusion couples prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed at a temperature of T = 453 K. Due to annealing, AuSn, AuSn2 and AuSn4 compound layers are formed at the interface in the diffusion couple. The experimental results were used to evaluate quantitatively the effect of Ni on the growth of the Au–Sn compounds. The evaluation indicates that the addition of Ni into Sn between 1 and 5 mass% accelerates the growth of the Au–Sn compounds at T = 433–473 K.

Info:

Periodical:

Materials Science Forum (Volumes 539-543)

Main Theme:

Edited by:

T. Chandra, K. Tsuzaki, M. Militzer , C. Ravindran

Pages:

2473-2478

DOI:

10.4028/www.scientific.net/MSF.539-543.2473

Citation:

M. Kajihara and T. Takenaka, "Kinetic Features of Solid-State Reactive Diffusion between Au and Sn-Base Solder", Materials Science Forum, Vols. 539-543, pp. 2473-2478, 2007

Online since:

March 2007

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$35.00

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