Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires

Abstract:

Article Preview

An overview of the microstructure evolution, mechanical properties, electrical conductivity and microalloying is presented and some further research fields are suggested for Cu-Ag microcomposites. The nanostructures of filamentary morphology in these microcomposites can be obtained by heavy deformation. Both the mechanical and electrical properties depend upon the material composition, strain degree, intermediate heat treatments and final annealing processes. These factors strongly affect the phase proportion, microstructure morphology, precipitate volume, hardening level and filamentary distribution. Optimum technology of materials preparation makes the microcomposites possess high strength and conductivity. Some third constituents added to the alloys improve the strength but generally decrease the conductivity. It is considered that relative mechanisms and processes should be further investigated for the development and application of the microcomposites.

Info:

Periodical:

Materials Science Forum (Volumes 539-543)

Main Theme:

Edited by:

T. Chandra, K. Tsuzaki, M. Militzer , C. Ravindran

Pages:

2798-2803

DOI:

10.4028/www.scientific.net/MSF.539-543.2798

Citation:

L. Meng and J.B. Liu, "Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires", Materials Science Forum, Vols. 539-543, pp. 2798-2803, 2007

Online since:

March 2007

Authors:

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.