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Paper Titles
Fabrication of Micro Porous Aluminum by Powder Sintering
p.2778
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Role of Strain Gradient and Dynamic Transformation on the Formation of Nanocrystalline Structure Produced by Severe Plastic Deformation
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An Effect of High Magnetic Field on Grain Growth in Nanocrystalline Iron
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Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires
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Non-Equilibrium Solute Partitioning and Microstructure Formation in Rapidly Solidified Al-Sm Alloys
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Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires

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Abstract:

An overview of the microstructure evolution, mechanical properties, electrical conductivity and microalloying is presented and some further research fields are suggested for Cu-Ag microcomposites. The nanostructures of filamentary morphology in these microcomposites can be obtained by heavy deformation. Both the mechanical and electrical properties depend upon the material composition, strain degree, intermediate heat treatments and final annealing processes. These factors strongly affect the phase proportion, microstructure morphology, precipitate volume, hardening level and filamentary distribution. Optimum technology of materials preparation makes the microcomposites possess high strength and conductivity. Some third constituents added to the alloys improve the strength but generally decrease the conductivity. It is considered that relative mechanisms and processes should be further investigated for the development and application of the microcomposites.

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Periodical:

Materials Science Forum (Volumes 539-543)

Pages:

2798-2803

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.539-543.2798

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Online since:

March 2007

Authors:

Liang Meng, J.B. Liu

Keywords:

Composite, Cu-Ag, Electrical Conductivity, Mechanical Property, Microstructure

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