Effect of Sn-Addition on the Bonding Strength between Casting Au-Pt-Cu Alloy and SiO2-Based Porcelain

Abstract:

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Effects of 0.5 wt% Sn-addition to the dental casting Au-12Pt-0.6Cu alloy on the interfacial microstructures and bonding strength between porcelain and the alloy were investigated. Porcelain powders (SiO2-based oxides) are bonded through a thermal schedule consisting of preoxidation, 1st firing, and 2nd firing. Interfacial microstructures were examined after pre-oxidation and 2nd firing, respectively, by scanning and transmission electron microscopy. The bonding strength of the Au-12Pt-0.6Cu and Au-12Pt-0.6Cu-0.5Sn alloys with porcelain was about 24.6 MPa and 46.2 MPa, respectively. The higher bonding strength of the Sn-added alloy compared with that of the alloy without Sn is attributed to the SnO2 formed at the interface between porcelain and the alloy during pre-oxidation. SnO2 layer is thought to enhance chemical bonding with various oxides in the porcelain and, accordingly, improve bonding strength.

Info:

Periodical:

Materials Science Forum (Volumes 544-545)

Edited by:

Hyungsun Kim, Junichi Hojo and Soo Wohn Lee

Pages:

175-178

DOI:

10.4028/www.scientific.net/MSF.544-545.175

Citation:

S.H. Lee et al., "Effect of Sn-Addition on the Bonding Strength between Casting Au-Pt-Cu Alloy and SiO2-Based Porcelain", Materials Science Forum, Vols. 544-545, pp. 175-178, 2007

Online since:

May 2007

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$35.00

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