Efficient Diffusion Bonding between BSCCO Superconducting Multifilamentary Tapes

Abstract:

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To improve the joining efficiency of Bi-Sr-Ca-Cu-O ( BSCCO) superconducting tapes, a new diffusion bonding technology with a direct uniaxial pressing at high temperature was developed to join 61-filament tapes. It was observed that bonding parameters such as bonding pressure and holding time, significantly affected the critical current ratio (CCRo). A peak CCRo value of 89 % for the lap-joined tapes was achieved at 3 MPa for 2 h when bonding temperature was 800 °C. Compared with the conventional diffusion bonding technology, this new technology remarkably shortened the fabrication period and improved the superconductivity of the joints. The bonding interface and microstructures of the joints were evaluated and correlated to the CCRo. An uniaxial pressing at high temperature was beneficial to interface bonding, and there was an optimal pressure value for the CCRo.

Info:

Periodical:

Materials Science Forum (Volumes 580-582)

Edited by:

Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na

Pages:

295-298

DOI:

10.4028/www.scientific.net/MSF.580-582.295

Citation:

G. S. Zou et al., "Efficient Diffusion Bonding between BSCCO Superconducting Multifilamentary Tapes", Materials Science Forum, Vols. 580-582, pp. 295-298, 2008

Online since:

June 2008

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Price:

$35.00

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