Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Abstract:

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The effects of strain rate in rolling on microstructures and mechanical properties of a nano-grained high purity copper processed by accumulative roll bonding (ARB) were studied. The rolling during ARB was conducted with two kinds of strain rates (2.6sec-1 and 37sec-1). The microstructural evolution of the copper with ARB proceeding was somewhat different in both methods. However, the variation of mechanical properties with ARB was very similar to each other.

Info:

Periodical:

Materials Science Forum (Volumes 580-582)

Edited by:

Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na

Pages:

71-74

DOI:

10.4028/www.scientific.net/MSF.580-582.71

Citation:

S. H. Lee et al., "Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process", Materials Science Forum, Vols. 580-582, pp. 71-74, 2008

Online since:

June 2008

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Price:

$35.00

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