Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process
The effects of strain rate in rolling on microstructures and mechanical properties of a nano-grained high purity copper processed by accumulative roll bonding (ARB) were studied. The rolling during ARB was conducted with two kinds of strain rates (2.6sec-1 and 37sec-1). The microstructural evolution of the copper with ARB proceeding was somewhat different in both methods. However, the variation of mechanical properties with ARB was very similar to each other.
Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na
S. H. Lee et al., "Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process", Materials Science Forum, Vols. 580-582, pp. 71-74, 2008