Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Seong Hee Lee; Sang Shik Kim; S.Z. Han; Cha Yong Lim

doi:10.4028/www.scientific.net/MSF.580-582.71

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HomeMaterials Science ForumMaterials Science Forum Vols. 580-582Effect of Strain Rate on Microstructural Evolution...

Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process

Abstract:

The effects of strain rate in rolling on microstructures and mechanical properties of a nano-grained high purity copper processed by accumulative roll bonding (ARB) were studied. The rolling during ARB was conducted with two kinds of strain rates (2.6sec-1 and 37sec-1). The microstructural evolution of the copper with ARB proceeding was somewhat different in both methods. However, the variation of mechanical properties with ARB was very similar to each other.