A Triple-Scale Crystal Plasticity Simulation on Yield Behavior of Annealed FCC Fine-Grained Metals

Eisuke Kurosawa; Yoshiteru Aoyagi; Yuichi Tadano; Kazuyuki Shizawa

doi:10.4028/www.scientific.net/MSF.584-586.1027

Paper Titles

Influence of HPT Deformation Temperature on Microstructures and Thermal Stability of Ultrafine-Grained Tungsten
p.1000

Control of Crystallographic Orientation and Grain Refinement in Bi₂Te₃-Based Thermoelectric Semiconductors by Applying High Pressure Torsion
p.1006

Diffusion in Ultrafine Grained Materials
p.1012

Finite Element Investigation of the Effect of Hardening Behavior of Alloys on Equal Channel Angular Pressing Performance
p.1021

A Triple-Scale Crystal Plasticity Simulation on Yield Behavior of Annealed FCC Fine-Grained Metals
p.1027

Formation of Multiply-Twinned Particles during Two-Nanoparticles Agglomeration: The Results of MD Simulation
p.1033

Long-Term Microhardness Evolution in Ti-Ni Shape Memory Alloys Processed by Severe Cold Rolling
p.1039

A Phase-Field Simulation of Nucleation from Subgrain and Grain Growth in Static Recrystallization
p.1045

Application of Strain Gradient Plasticity Modelling to High Pressure Torsion
p.1051

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A Triple-Scale Crystal Plasticity Simulation on Yield Behavior of Annealed FCC Fine-Grained Metals

Abstract:

In this study, the conventional Bailey-Hirsch’s relationship is extended in order to express the increase of critical resolved shear stress due to the lack of dislocation lines in a grain. This model is introduced into a triple-scale crystal plasticity model based on geometrically necessary crystal defects and the homogenization method. A FE simulation is carried out based on the proposed model for FCC polycrystals with different grain sizes. It is numerically predicted that yield behavior of fine-grained metals depends on the initial dislocation density and the initial grain size. Furthermore, yield point drop that is observed in annealed FCC fine-grained metal can be reproduced.