Life Time Predictions through X-Ray Defect Analysis of MEMS Devices

Antonia Neels; Philippe Niedermann; Alex Dommann

doi:10.4028/www.scientific.net/MSF.584-586.518

Paper Titles

Strain Gradient Hardening and Pressure Induced Phase Transformation of Metals by HPT
p.493

Effect of Pre-Aging on the Microstructure and Strength of Supersaturated AlZnMg Alloys Processed by ECAP
p.501

Nanostructured Shape Memory TiNi Alloy Processed by Severe Electroplastic Deformation
p.507

Texture Gradient in a Single Pass ECAPed Pure Mg by Neutron Radiation
p.513

Life Time Predictions through X-Ray Defect Analysis of MEMS Devices
p.518

Effect of the Second Phase on the Microstructure of Magnesium Alloys during Cyclic Extrusion Compression
p.523

Grain Boundary Structure and Deformation Defects in Nanostructured Al–Mg Alloys Processed by High Pressure Torsion
p.528

Microstructure and Properties of Aluminium Processed by Constrained Groove Pressing
p.535

Particle Redistribution and Grain Refinement during Processing by Hydrostatic Extrusion
p.541

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Life Time Predictions through X-Ray Defect Analysis of MEMS Devices

Abstract:

In single crystal silicon (SCSi) MEMS devices, crystalline imperfection is recognized to favor failure. A DRIE etched SCSi structure was built to study the crystal strain profile in dependence of the SCSi deformation by applying a mechanical force. High resolution X-ray diffraction methods such as the rocking curve method and reciprocal space mapping were used to determine the strain as well as the defect concentration in the crystal. The investigations also include the numerical simulation of deformations.