Life Time Predictions through X-Ray Defect Analysis of MEMS Devices
In single crystal silicon (SCSi) MEMS devices, crystalline imperfection is recognized to favor failure. A DRIE etched SCSi structure was built to study the crystal strain profile in dependence of the SCSi deformation by applying a mechanical force. High resolution X-ray diffraction methods such as the rocking curve method and reciprocal space mapping were used to determine the strain as well as the defect concentration in the crystal. The investigations also include the numerical simulation of deformations.
Yuri Estrin and Hans Jürgen Maier
A. Neels et al., "Life Time Predictions through X-Ray Defect Analysis of MEMS Devices", Materials Science Forum, Vols. 584-586, pp. 518-522, 2008