Two kinds of W/Cu functionally graded material based high heat flux components, including monoblock concept and flat tile concept, are designed and fabricated. Thermally induced stresses and strains under operation conditions in these components are analyzed using finite element analysis. The effect on stress and strain of using different graded structures to join Cu to W is examined and compared. There has no obvious difference on operation thermal stress mitigating between monoblock design and flat tile design. The component with monoblock concept was fabricated by a one step fast resistance sintering, and the component with flat tile concept was fabricated by infiltration-welding method successfully.