Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material

Je Sik Shin; Hyung Kwon Moon; Bong Hwan Kim; Hyo Soo Lee; Hyouk Chon Kwon

doi:10.4028/www.scientific.net/MSF.654-656.2728

Paper Titles

Cast Bonding of Cast Irons to Ferritic Stainless Steel
p.2712

Effectiveness of Residual Stress on Forming Copper Patterns of Printed Circuit Board
p.2716

Thermal Stability of Fe Filaments in Deformed Cu-Fe Composites
p.2720

Effects of Cu Powder Size on the Microstructure of TiB₂/Cu Composites Fabricated by Reactive Infiltration Process
p.2724

Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material
p.2728

A Research on Interfacial Reaction of Brazing Joint of Alumina Ceramics to Metals
p.2732

Anatase-Type Ti_1-2xNb_xAl_xO₂ Solid Solution/Silica (SiO₂) Composite Nanoparticles: Synthesis, Phase Stability, and Photocatalytic Performance
p.2735

Synthesis of Ni₃Al/ZrO₂ Nanocomposite and Study on Its High Temperature Oxidation in Mixed Gas Environment
p.2739

Crystallization of Amorphous SiCN Matrix of C/SiCN Composite under Conditions of Vacuum and Tension-Tension Fatigue
p.2743

HomeMaterials Science ForumMaterials Science Forum Vols. 654-656Fabrication and Properties of a Combined...

Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material

Abstract:

In this study, it was aimed to develop a novel interconnect material simultaneously possessing high electrical conductivity and strength. Combined structural Cu sheets were fabricated by forming the high electrical conduction paths of Ag on the surface of high strength Cu alloy substrate by damascene electroplating. As a result, the electrical conductivity increased by 40%, while the ultimate tensile strength decreased by only 20%. When the depth of Ag conduction path was deep, fracture zone ratio as well as roll-over zone increased.