Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material
In this study, it was aimed to develop a novel interconnect material simultaneously possessing high electrical conductivity and strength. Combined structural Cu sheets were fabricated by forming the high electrical conduction paths of Ag on the surface of high strength Cu alloy substrate by damascene electroplating. As a result, the electrical conductivity increased by 40%, while the ultimate tensile strength decreased by only 20%. When the depth of Ag conduction path was deep, fracture zone ratio as well as roll-over zone increased.
Jian-Feng Nie and Allan Morton
J. S. Shin et al., "Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material", Materials Science Forum, Vols. 654-656, pp. 2728-2731, 2010