Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material

Abstract:

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In this study, it was aimed to develop a novel interconnect material simultaneously possessing high electrical conductivity and strength. Combined structural Cu sheets were fabricated by forming the high electrical conduction paths of Ag on the surface of high strength Cu alloy substrate by damascene electroplating. As a result, the electrical conductivity increased by 40%, while the ultimate tensile strength decreased by only 20%. When the depth of Ag conduction path was deep, fracture zone ratio as well as roll-over zone increased.

Info:

Periodical:

Materials Science Forum (Volumes 654-656)

Main Theme:

Edited by:

Jian-Feng Nie and Allan Morton

Pages:

2728-2731

DOI:

10.4028/www.scientific.net/MSF.654-656.2728

Citation:

J. S. Shin et al., "Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material", Materials Science Forum, Vols. 654-656, pp. 2728-2731, 2010

Online since:

June 2010

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Price:

$35.00

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