Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

Yao Li Wang; Gai Hong Dong; Chen Yang Li; Zhi Wei Wu; Jing Sun

doi:10.4028/www.scientific.net/MSF.687.39

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HomeMaterials Science ForumMaterials Science Forum Vol. 687Effect of RE on Creep Rupture Life of SnAgCu...

Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

Abstract:

Creep property is one of the most important factors to affect the reliability of soldered joints. The effect of rare earth(RE) on the creep rupture life of Sn2.5Ag0.7Cu solder joints were investigated under constant temperature and stress using creep specimens with a 1mm² cross sectional area. The results show that adding tiny RE in Sn2.5Ag0.7Cu solder alloy can effectually affect the size and configuration of the intermetallic compound (IMC) of interfacial layer. The IMC of Sn2.5Ag0.7Cu interfacial layer is thinner and its thickness is homogeneous with adding 0.1% RE, and the creep rupture life of solder joints is longest, which is apparently superior to that of Sn2.5Ag0.7Cu and commercial used Sn3.8Ag0.7Cu solder alloy.

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Periodical:

Materials Science Forum (Volume 687)

Pages:

39-43

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.687.39

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Online since:

June 2011

Authors:

Yao Li Wang, Gai Hong Dong, Chen Yang Li, Zhi Wei Wu, Jing Sun

Keywords:

Creep Rupture Life, IMC, Re, Sn2.5Ag0.7Cu Solder Alloy

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