Studies on the Thermodynamic and the Miscibility Gap of the Cu₂O-Al₂O₃-SiO₂ Pseudo-Ternary System

Abstract:

Cu₂O-Al₂O₃-SiO₂ ternary system of given compositions can be used as a kind of thermal shock resistance sealing materials for electronic devices. So far, little systematic work was reported on the phase behavior and phase equilibrium at a high temperature, except the isothermal section of a CuO-Al₂O₃–SiO₂ ternary system at 950 and 1150°C. We have investigated the thermodynamic behavior and the microstructure of the compositions in the miscibility gap of the Cu₂O-Al₂O₃-SiO₂ pseudo-ternary system on the basis of the reported isothermal section of this system at 1150°C based on the analyzing of the differential scanning calorimeter and the observing of the scanning electronic microscope. The eutectic point of the Cu₂O-Al₂O₃-SiO₂ pseudo-ternary system was determined by the thermal analysis. Then, the changing rule of the microstructures with different compositions was investigated. The results indicated that large differences existed among the different compositions in the miscibility gap of Cu₂O-Al₂O₃-SiO₂ ternary system.

• Periodical: Materials Science Forum (Volume 689)
• Pages: 440-444
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.689.440
• Online since: June 2011
• Authors: Qiu Guo Xiao, Gang Cheng Ding, Tang Zhong Long, Ming Min Zhang, Shao Hua Shen
• Keywords: Liquid Miscibility, Morpholoy, Thermal Analysis

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