Study on Microstructure and Impact Strength of Nano-SiO2 Toughened Epoxy Resin Composites

Article Preview

Abstract:

In this paper, composites with different contents of epoxy resin/nano-SiO2 were fabricated, the influence of compounding process on nano-SiO2 dispersion was studied, the microstructure and the relationship between impact strength and nano-SiO2 content were investigated. The results showed that the distribution of nano-SiO2 particles in the composites could be improved efficiently using high-speed shearing dispersion method. To composites with or without the coupling agent treatment, the impact strength grew with increasing nano-SiO2 content, and increase to a maximum value when nano-SiO2 content was 3wt.%. The maximum value was 75.4%, and 45.5% higher than that of monolithic epoxy resin respectively. With the nano-SiO2 content increased continually, the impact strength of composite materials decreased. The coupling agent treatment of nano-SiO2 administered to improve the impact strength of the composites.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

465-468

Citation:

Online since:

July 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] A. Omrani, A. A. Rostami: Materials Science and Engineering A. Vol. 517(2009), p.185.

Google Scholar

[2] P. Maity1, P. K. Poovamma, S. Basu1, V. Parameswaran and Nandini Gupta: IEEE Transactions on Dielectrics and Electrical Insulation. Vol. 16(2009), p.1481.

Google Scholar

[3] M. Kurimoto and H. Watanabe: IEEE Conf. Electr. Insul. Dielectr. Phenomena. (2008), p.706.

Google Scholar

[4] L. H. Cheng: Physica. Vol. B403 (2008), p.2584.

Google Scholar

[5] F.F. Lange, K. C . Radford: Journal of Material Science, Vol. 6(1971), p.1197.

Google Scholar

[6] T. Tanaka: IEEE Transactions on Dielectrics and Electrical Insulation. Vol. 12(2005), p.914.

Google Scholar

[7] J.K. Nelson and Y. Hu: IEEE International Conference on Solid Dielectrics (ICSD). Vol. 2(2004), p.832.

Google Scholar

[8] J.C. Fothergill, J.K. Nelson and M. Fu: Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP). (2004), p.406.

Google Scholar