Experimental Investigation of Texture Gradients in Aluminium/Copper Plates Bonded through Explosive Welding Process

Abstract:

Article Preview

In this study, the commercial purity Al/Cu plates were bonded through the explosive welding process. The SEM/EBSD local orientation measurements were conducted to consider the changes in the microstructure and the development of texture gradients for the applied explosive loading. A particular attention was paid to the texture changes across the interface. The detailed local orientation measurements show that the ultra-fine grained layers are formed close to the bonding zone. The layers were characterized by the copper-type rolling texture components. The interface was outlined by a characteristic sharp transition between the two materials. However, in some places, local melted zones were also encountered, mainly in the front slope of the waves.

Info:

Periodical:

Materials Science Forum (Volumes 702-703)

Edited by:

Asim Tewari, Satyam Suwas, Dinesh Srivastava, Indradev Samajdar and Arunansu Haldar

Pages:

603-606

DOI:

10.4028/www.scientific.net/MSF.702-703.603

Citation:

H. Paul et al., "Experimental Investigation of Texture Gradients in Aluminium/Copper Plates Bonded through Explosive Welding Process", Materials Science Forum, Vols. 702-703, pp. 603-606, 2012

Online since:

December 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.