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Experimental Investigation of Texture Gradients in Aluminium/Copper Plates Bonded through Explosive Welding Process
Abstract:
In this study, the commercial purity Al/Cu plates were bonded through the explosive welding process. The SEM/EBSD local orientation measurements were conducted to consider the changes in the microstructure and the development of texture gradients for the applied explosive loading. A particular attention was paid to the texture changes across the interface. The detailed local orientation measurements show that the ultra-fine grained layers are formed close to the bonding zone. The layers were characterized by the copper-type rolling texture components. The interface was outlined by a characteristic sharp transition between the two materials. However, in some places, local melted zones were also encountered, mainly in the front slope of the waves.
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603-606
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December 2011
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© 2012 Trans Tech Publications Ltd. All Rights Reserved
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