Experimental Investigation of Texture Gradients in Aluminium/Copper Plates Bonded through Explosive Welding Process
In this study, the commercial purity Al/Cu plates were bonded through the explosive welding process. The SEM/EBSD local orientation measurements were conducted to consider the changes in the microstructure and the development of texture gradients for the applied explosive loading. A particular attention was paid to the texture changes across the interface. The detailed local orientation measurements show that the ultra-fine grained layers are formed close to the bonding zone. The layers were characterized by the copper-type rolling texture components. The interface was outlined by a characteristic sharp transition between the two materials. However, in some places, local melted zones were also encountered, mainly in the front slope of the waves.
Asim Tewari, Satyam Suwas, Dinesh Srivastava, Indradev Samajdar and Arunansu Haldar
H. Paul et al., "Experimental Investigation of Texture Gradients in Aluminium/Copper Plates Bonded through Explosive Welding Process", Materials Science Forum, Vols. 702-703, pp. 603-606, 2012