Boundary Migration during Recrystallization of Heavily Deformed Pure Nickel

Yu Bin Zhang; Dorte Juul Jensen; Andrew Godfrey

doi:10.4028/www.scientific.net/MSF.715-716.329

Paper Titles

Recrystallization Processes in a Ni-20%Cr Alloy Subjected to High-Pressure Torsion
p.309

Tales of the Abnormal: Nanocrystalline Grain Growth at Low Temperatures
p.315

The Effect of Temperature on Microstructure Evolution in a 7055 Aluminum Alloy Subjected to ECAP
p.317

Thermodynamic Stabilization of Grain Size in Nanocrystalline Metals
p.323

Boundary Migration during Recrystallization of Heavily Deformed Pure Nickel
p.329

Self-Limited to Parabolic Grain Growth Kinetics in Metal Oxide Thin Films
p.333

Influence of Annealing Process on Recrystallisation Behaviour of a Heavily Cold Rolled AISI 304L Stainless Steel on Ultrafine Grain Formation
p.334

Grain Size Control in the Weld Pool and Heat Affected Zone Using Holograms
p.340

Recrystallization in Ultra-Fine Grain Structures of AA3104 Alloy Processed by ECAP and HPT
p.346

HomeMaterials Science ForumMaterials Science Forum Vols. 715-716Boundary Migration during Recrystallization of...

Boundary Migration during Recrystallization of Heavily Deformed Pure Nickel

Abstract:

The detailed microstructure in front of recrystallization boundaries and their migration during annealing were traced using ex-situ electron backscatter pattern maps of one and the same surface area taken after annealing. It is observed that many protrusions/detrusions form on the recrystallizing boundaries. During annealing, the recrystallization boundary segments migrate in a stop-go type of fashion, while protrusions and detrusions alternately form and disappear. The correlation between the protrusions/detrusions and the stop-go type of migration are briefly discussed.