Grain Growth Stagnation Caused by the Grain Boundary Roughening Transition

Elizabeth A. Holm; Stephen M. Foiles

doi:10.4028/www.scientific.net/MSF.715-716.415

Paper Titles

Thermal Behavior of Nickel Deformed to Ultra-High Strain by High Pressure Torsion
p.387

New 3DXRD Results on Recrystallization and Grain Growth
p.393

Simulation of Recrystallization and Recrystallization Textures in Aluminium Alloys
p.399

Laser-Ultrasonic Austenite Grain Size Measurements in Low-Carbon Steels
p.407

Grain Growth Stagnation Caused by the Grain Boundary Roughening Transition
p.415

A Hybrid Modelling Approach Applied to the Evolution of Microstructure during Plane Strain Deformation
p.416

Derivation of Statistical Model of Grain Growth Based on 3-D Von Neumann Equation
p.427

Simulation of Line Annealing of Type 430 Ferritic Stainless Steel
p.437

In Situ Observation of Recovery and Grain Growth in High Purity Aluminum
p.447

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Grain Growth Stagnation Caused by the Grain Boundary Roughening Transition

Abstract:

Molecular dynamics simulations of bicrystals show that grain boundaries undergo a thermal roughening transition, and the grain boundary mobility increases abruptly when the boundary roughens. The roughening transition temperature varies widely from boundary to boundary, ranging from less than 0.4 to more than 0.9 of the melting temperature. Thus, at typical annealing temperatures we expect polycrystals to contain both smooth (slow) and rough (fast) boundaries, with the fraction of each type varying with temperature.