Grain Boundary Triple Line Tension in Copper

Abstract:

The current study introduces a thermodynamically correct approach which allows a direct precise measurement of the grain boundary triple line tension. The experimental technique utilizes the measurement of the surface topography of a crystal in the vicinity of a triple junction and grain boundary groove on thin wires by atomic force microscopy. The grain boundary triple line tension of a random triple line was measured to be in the order of 10^-9 J/m.

• Periodical: Materials Science Forum (Volumes 715-716)
• Pages: 843-848
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.715-716.843
• Online since: April 2012
• Authors: Bing Bing Zhao, Lasar S. Shvindlerman, Günter Gottstein
• Keywords: Grain Boundary, Thermal Groove, Triple Line Tension

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