Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel

Abstract:

The copper alloy/30CrMnSi steel bi-metal composite materials were prepared by the interface diffusion bonding method. The diffusion of elements close to the bonding interface was studied and the formation and growth mechanism of dissolution layer were discussed as well. The results showed that a diffusion transition layer could be formed with the different widths for copper alloy/30CrMnSi steel integrated material. A diffusion transition layer was formed close to 30CrMnSi steel side due to the inter-diffusion of the alloy elements. The microstructure characterization showed that no harmful brittle phase presented around the interface, and two heterogeneous materials had a good metallurgical bonding.

• Periodical: Materials Science Forum (Volume 749)
• Pages: 168-172
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.749.168
• Online since: March 2013
• Authors: Jun Tao Zou, Yan Feng Liu, Lu Pei, Xian Hui Wang, Shu Hua Liang
• Keywords: 30CrMnSi Steel, Copper Alloy, Interface Diffusion, Transition Layer

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