Heat Transfer Performance of Lotus-Type Porous Copper Micro-Channel Heat Sink

Abstract:

Lotus-type porous structure is a new kind of micro-channel structure and can be used as heat sink for heat elimination of high powered electronic devices. Numerical analysis based on the simple fin model was used to predict the equivalent heat transfer coefficient of lotus-type porous copper micro-channel heat sink. Compared with the water, GaInSn working fluid could further promote the heat transfer performance of the heat sink. According to the theoretical analysis, a heat transfer coefficient as high as 14W/(cm²K) was attainable when the pressure drop was 50 KPa and an appropriate structure parameters: 0.4 mm in pore diameter, 0.4 in porosity and 4mm in height of porous copper were achieved.

• Periodical: Materials Science Forum (Volume 749)
• Pages: 414-420
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.749.414
• Online since: March 2013
• Authors: Hai Feng Chen, Yuan Liu, Liu Tao Chen, Yan Xiang Li
• Keywords: Heat Transfer, Liquid Metal, Micro-Channel Heat Sink, Porous Metals

References

[1] P. Rodgers, V. Eveloy, M.G. Pecht, Limits of air-cooling: status and challenges, Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE. (2005) 116-124.

DOI: 10.1109/stherm.2005.1412167

[2] D.B. Tuckerman, R.F.W. Pease, IEEE Electron Dev Lett. (1981) 2-126.

[3] P. Rosa, T.G. Karayiannis, M.W. Collins, Single-phase heat transfer in microchannels: The importance of scaling effects, Appl Therm Eng. (2009) 29-3447.

DOI: 10.1016/j.applthermaleng.2009.05.015

[4] X. Wei, Stacked micro-channel heat sinks for liquid cooling of microelectronic components, J Electron Packaging. 126(2004)60-66.

DOI: 10.1115/1.1647124

[5] T. Ogushi, H. Chiba, H. Nakajima, Measurement and Analysis of Effective Thermal Conductivities of Lotus-Type Porous Copper, J Appl Phys. 95 (2004) 843-5847.

DOI: 10.1063/1.1691188

[6] H. Chiba, T. Ogushi, H. Nakajima, Steady state comparative-longitudinal heat flow method using specimen of different thicknesses for measuring thermal conductivity of lotus-type porous metals, J Appl Phys. 103 (2008) 013515-013515-9.

DOI: 10.1063/1.2830843

[7] Y. Liu, Y.X. Li, H.W. Zhang, Pressure Condition for Formation of Lotus-Type Regular Porous Structure and Evolution of Pore Size, Acta Metall Sin. 41(2005)886-890.

[8] Y.X. Li,Y. Liu, H.W. Zhang, Proceedings of MetFoam 2005, Sendai: The Japan Institute of Metals (2006).

[9] H.W. Zhang, Y.X. Li, Y, Liu, Evalution of Porosity in Lotus-Type Porous Cu Fabricated with GASAR Process, Acta Metall Sin. 42 (2006) 1165-1170.

[10] H.W. Zhang, Y.X. Li, Y, Liu, Gas Pressure Condition for Obtaining Uniform Lotus-Type Porous Structure by GASAR Process, Acta Metall Sin. 42 (2006) 1171-1176.

[11] T. Ogushi, H. Chiba, H. Nakajima, Proceedings of MetFoam 2005, Sendai: The Japan Institute of Metals (2006).

[12] H. Chiba, T. Ogushi, H. Nakajima, Proceedings of MetFoam 2005, Sendai: The Japan Institute of Metals (2006).

[13] L.T. Chen, H.W. Zhang, Liu Y, Experimental Research on Heat Transfer Performance of Directionally Solidified Porous Copper Heat Sink, Acta Metall Sin. 48 (2012) 329-333.

DOI: 10.3724/sp.j.1037.2011.00703

[14] X.S. Lu, Numerical Simulating Liquid of metal Current (GaInSn) in Fault Current Limiter. Master's thesis, Nanjing University (2008).