Analysis of Lead in SnAg Based Solders Using X-Ray Fluorescence

Abstract:

This paper reports the results of ED-XRF method for the determination of low-level contaminated solders. The method was calibrated for the analysis of part-per-million (ppm) levels of Pb and major levels of other elements. In this work, two types of Sn-Ag based solder alloys are used; the ternary Sn-3.0wt%Ag-0.5wt%Cu (SAC305) and the 6-part Sn-3.5wt%Ag-3.2wt%Bi-1.6wt%Sb-0.5wt%Cu-0.15wt%Ni were examined. Empirical calibration and fundamental parameter calibration were used to analyze samples. The results of this study demonstrate the differences between the applied calibration methods for detection of Pb. Screening analysis of bulk samples from variant production lines were also discussed.

• Periodical: Materials Science Forum (Volume 752)
• Pages: 37-41
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.752.37
• Online since: March 2013
• Authors: Dániel Koncz-Horváth, Zoltána Gácsi
• Keywords: Energy Dispersive X-Ray Fluorescence, Fundamental Parameter Method, Lead-Free Soldering Technology, RoHS

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