3D Analysis of Microstructure Changes Occurring during Creep Tests of Ultra-Fine Grained Materials

Petr Král; Jiří Dluhoš; Pavel Peřina; Tomáš Barták

doi:10.4028/www.scientific.net/MSF.753.46

Paper Titles

In Situ Measurements of Grain Growth and Recrystallization by Laser Ultrasonics
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The Industrial Application of Microstructure Modelling: A View out of the Process Window
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Importance of Local Structural Variations on Recrystallization
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Texture and Microstructure Evolution of a Zirconium Alloy During Uniaxial Compression at 500°C
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3D Analysis of Microstructure Changes Occurring during Creep Tests of Ultra-Fine Grained Materials
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Microstructure Development in Single and Double-Pass Friction Stir Processing of Aluminium
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Orientation Dependence of the Substructure Characteristics in a Ni-30%Fe Austenitic Alloy Deformed in Hot Torsion
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Evolution of Heterogeneous Deformation Structure and Recrystallization Texture of Steel
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Microstructure Evolution and Softening Processes in Hot Deformed Austenitic and Duplex Stainless Steels
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HomeMaterials Science ForumMaterials Science Forum Vol. 7533D Analysis of Microstructure Changes Occurring...

3D Analysis of Microstructure Changes Occurring during Creep Tests of Ultra-Fine Grained Materials

Abstract:

Experiments were conducted to determine microstructure changes occurring during thermal exposure in metals processed by equal-channel angular pressing (ECAP). The ECAP pressing was performed at room temperature by route Bc. Static annealing and constant load creep tests in tension were conducted at 0.3-0.5 Tm. The microstructure was examined by scanning electron microscope combined with focus ion beam - TESCAN LYRA 3 equipped with electron back scatter diffraction (EBSD). It was found that creep behaviour is influenced by synergetic effect of additional creep mechanisms like grain boundary sliding, more intensive diffusion processes or recrystallization.

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Periodical:

Materials Science Forum (Volume 753)

Pages:

46-49

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.753.46

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Online since:

March 2013

Authors:

Petr Král, Jiří Dluhoš, Pavel Peřina, Tomáš Barták

Keywords:

3D EBSD, Creep, ECAP, Focused Ion Beam (FIB), Recrystallization

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