Research Progress of Interface on Diamond/Copper Composites for Thermal Management

Abstract:

Diamond/Copper composite (Diamond/Cu) is a kind of ideal thermal management material, with high thermal conductivity and low thermal expansion. While the interface control is the center of the Diamond/Cu composites design. This paper summarizes the relevant studies on Diamond/Cu composite interface, including the researches of author’s group and other researchers. In addition, the prospect of research is mainly elaborated from following three parts: using carbide elements to control and improve the diamond/Cu composite interface bonding; the introduction of the research on Diamond/Cu composite interface with technologies of powder metallurgy, high temperature and high pressure process, spark plasma sintering and pressure infiltration; studying the thermal conductivity of Diamond/Cu composite by SThM analysis and testing technology and the Hasselman-Johnson model. The results show that controlling and improving the quality of Diamond/Cu composite interface bonding can improve the performance and stability of the composite.

• Periodical: Materials Science Forum (Volume 788)
• Pages: 680-688
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.788.680
• Online since: April 2014
• Authors: Peng Peng Wang*, Hong Guo, Xi Min Zhang, Fa Zhang Yin, Ye Ming Fan, Yuan Yuan Han
• Keywords: Carbide, Diamond/Cu Composites, Interface, Interface Improvements, Interfacial Thermal Resistance

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