Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder

Norhayanti Mohd Nasir; Norainiza Saud; Mohd Nazree B. Derman; Arif Anuar Mohd Salleh; Mohd Izrul Izwan Ramli; Rita Mohd Said

doi:10.4028/www.scientific.net/MSF.803.273

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HomeMaterials Science ForumMaterials Science Forum Vol. 803Effect of TiO2 Reinforcement on Microstructure and...

Effect of TiO₂ Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder

Abstract:

This research has investigated the physical performances of low-silver Sn-Ag-Cu (SAC) lead-free composite solder reinforced with titanium dioxide (TiO₂). The SAC/TiO₂ composite solder were fabricated via powder metallurgy (PM) technique. The five different composition chosen were 0, 0.25, 0.5, 0.75, and 1.0. The results showed that distribution of TiO₂ along the grain boundaries has increased the hardness of the SAC/TiO₂ composite solders compared to monolithic SAC solder alloy.

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Periodical:

Materials Science Forum (Volume 803)

Pages:

273-277

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.803.273

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Online since:

August 2014

Authors:

Norhayanti Mohd Nasir*, Norainiza Saud, Mohd Nazree B. Derman, Arif Anuar Mohd Salleh, Mohd Izrul Izwan Ramli, Rita Mohd Said

Keywords:

Composite Solder, Lead-Free, Powder metallurgy, SAC107, Titanium Oxide

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References

[1] M. Abtew, and G. Selvaduray: Materials Science Engineering, 27, p.95–141. (2000).

Google Scholar

[2] H.L. John, T.H. Phang, B.S. Low, X. L. Xiong and C.C. Neo: Thin Solid Films, p.462–463, 370– 375. (2004).

Google Scholar

[3] K. Suganuma, in: An International Summit on Lead-Free Electronics Assemblies. (1999).

Google Scholar

[4] M.H. Biglari, M. Oddy, M.A. Oud, P. Davis, E.E. de Kluizenaar, P. Langeveld, and D. Schwarzbach, in: Proceedings Electronics Goes Green 2000+, Berlin, Germany. (2000).

Google Scholar

[5] NCMS , in : National Center for Manufacturing Sciences. (1997).

Google Scholar

[6] K.S. Kim, S.H. Huh, K. Suganuma: Journal of Alloys and Compounds, 352, p.226–236. (2003).

Google Scholar

[7] K. Nimmo, in: Proceedings of the International Summit on Lead-Free Electronics Assembly. (1999).

Google Scholar

[8] NEMI, in: www. nemi. org/Pbfreepublic/index. html". (2000).

Google Scholar

[9] M.F.M. Sabri, D.A. Shnawah, I.A. Badruddin and S.M. Said: Journal of Alloys and Compounds, 582, p.437–446. (2014).

Google Scholar

[10] S.M.L. Nai, J. Wei, M. Gupta: Thin Solid Films, 504, p.401 – 404. (2006).

Google Scholar

[11] L.C. Tsao, and S.Y. Chuang: Material Design, 31, p.990–3. (2010).

Google Scholar

[12] M.A.A. Mohd Salleh, A.M. Mustafa Al Bakri, M.H. Zan@Hazizi, Flora Somidin Noor Farhani Mohd Alui, Zainal Ariﬁn Ahmad: Materials Science & Engineering A, 556, p.633–637. (2012).

DOI: 10.1016/j.msea.2012.07.039

Google Scholar

[13] S. Yaowu, L. Jianping, X. Zhidong, L. Yongping, G. Fu and L. Xiaoyan:, Journal Materials Science Material Electron, 19, p.349–56. (2008).

Google Scholar