Study on the Factors of Residual Thermal Stress on Single Lap Joint

Abstract:

This paper discussed the residual thermal stress on single lap joint of various materials. Finite element method (FEM) was adopted to simulate the experimental phenomena. The adherend and adhesive were the main research objects. Mismatch of adherend, adhesive thickness, temperature variation which were the three key factors on the residual thermal stress were analyzed. While, four kinds of materials that include C/SiC, SiC, high temperature nickel based alloy GH1035 (GH1035) and high temperature boron fiber reinforced epoxy composite (composite) formed seven approaches for numerical analysis. The results showed that the adhesive with the C/SiC has the best performance and the best thickness of every approach was determined. Moreover, the ladder temperature is better than other temperature styles.

• Periodical: Materials Science Forum (Volume 813)
• Pages: 28-34
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.813.28
• Online since: March 2015
• Authors: Cheng Kun Ma, Ji Feng Zhang*, Bin Yang, Lu Zhang, Qi Chen
• Keywords: Finite Element Method, Residual Thermal Stress, Single Lap Joint, Theoretical Calculation

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