High Temperature High Strain-Rate Tensile and Compressive Deformation Behaviors of Cu-Zn-Sn-Al Alloy

Article Preview

Abstract:

The present work gives a systematic study on the high temperature and high strain-rate deformation behaviors of a two-phase α/β Cu-Zn-Sn-Al alloy, by combining the split Hopkinson bar experiments and microstructural investigations. The results show that under high strain-rate, both the dislocation slip and deformation twins within the α phase contribute to the plastic strengthening of Cu-Zn-An-Al alloy, resulting in the strain-rate-hardening effect. As the deformation temperature increases, the shapes of the stress-strain curves are mainly influenced by the temperature-softening effect and the dynamic recrystallization of the α phase. Finally, material constants regarding the strain-rate-hardening and temperature-softening effects are determined, based on the Johnson-Cook constitutive model. The results show that compared with other metallic materials, the present Cu-Zn-Sn-Al alloy has a relatively stronger strain-rate-hardening effect and weaker temperature-softening effect.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

55-62

Citation:

Online since:

April 2015

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2015 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] Y. Wang, Y.X. Zhou, Y.M. Xia, A constitutive description of tensile behavior for brass over a wide range of strain rates, Mater. Sci. Eng. A 372 (2004) 186-190.

DOI: 10.1016/j.msea.2003.12.009

Google Scholar

[2] M.A. Meyers, Dynamic behavior of materials, John Wiley & Sons Inc., (1994).

Google Scholar

[3] S. Nemat-Nasser, J.B. Isaacs, M.Q. Liu, Microstructure of high-strain, high-strain-rate deformed tantalum, Acta Mater. 46 (1998) 1307-1325.

DOI: 10.1016/s1359-6454(97)00746-5

Google Scholar

[4] L. Tang, Z.Y. Chen, C.K. Zhan, X.Y. Yang, C.M. Liu, H.N. Cai, Microstructural evolution in adiabatic shear bands of copper at high strain rates: Electron backscatter diffraction characterization, Mater. Charact. 64 (2012) 21-26.

DOI: 10.1016/j.matchar.2011.11.011

Google Scholar

[5] B.K. Kad, J.M. Gebert, M.T. Pérez-Prado, M.E. Kassner, M.A. Meyers, Ultrafine-grain-sized zirconium by dynamic deformation, Acta Mater. 54 (2006) 4111-4127.

DOI: 10.1016/j.actamat.2006.03.053

Google Scholar

[6] U. Andrade, M.A. Meyers, K.S. Vecchio, A.H. Chokshi, Dynamic recrystallization in high-strain, high-strain-rate plastic deformation of copper, Acta Metall. Mater. 42 (1994) 3183-3195.

DOI: 10.1016/0956-7151(94)90417-0

Google Scholar

[7] B. Zhang, V.P.W. Shim, Effect of strain rate on microstructure of polycrystalline oxygen-free high conductivity copper severely deformed at liquid nitrogen temperature, Acta Mater. 58 (2010) 6810-6827.

DOI: 10.1016/j.actamat.2010.09.009

Google Scholar

[8] F. Yazdani, M.N. Bassim, A.G. Odeshi, The formation of adiabatic shear bands in copper during torsion at high strain rates, Procedia Engineering 1 (2009) 225-228.

DOI: 10.1016/j.proeng.2009.06.053

Google Scholar

[9] M.A. Meyers, Y.B. Xu, Q. Xue, M.T. Pérez-Prado, T.R. McNelley, Microstructural evolution in adiabatic shear localization in stainless steel, Acta Mater. 51 (2003) 1307-1325.

DOI: 10.1016/s1359-6454(02)00526-8

Google Scholar

[10] M. Baig, A.S. Khan, S.H. Choi, A. Jeong, Shear and multiaxial responses of oxygen free high conductivity (OFHC) copper over wide range of strain-rates and temperatures and constitutive modeling, International Journal of Plasticity 40 (2013).

DOI: 10.1016/j.ijplas.2012.07.004

Google Scholar

[11] G.R. Johnson, W.H. Cook, Proc. 7th Int. Symp. On Ballistics, ADPA, The Netherlands, (1983).

Google Scholar

[12] M.A. Meyers, U.R. Andrade, A.H. Chokshi, The Effect of Grain Size on the High-Strain, High-Strain-Rate Behavior of Copper, Metall. Mater. Trans. A 26 (1995) 2881-2893.

DOI: 10.1007/bf02669646

Google Scholar

[13] A. Mishra, M. Martin, N.N. Thadhani, B.K. Kad, E.A. Kenik, M.A. Meyers, High-strain-rate response of ultra-fine-grained copper, Acta Mater. 56 (2008) 2770-2783.

DOI: 10.1016/j.actamat.2008.02.023

Google Scholar

[14] T.G. Tang, C.L. Liu, On the constitutive model for oxygen-free high-conductivity copper under high strain-rate tension, Explosion and Shock Waves 33 (2013) 581-586.

Google Scholar

[15] U. Hofmann, E. El-Magd, Behaviour of Cu-Zn alloys in high speed shear tests and in chip formation processes, Mater. Sci. Eng. A 395 (2005) 129-140.

DOI: 10.1016/j.msea.2004.12.030

Google Scholar

[16] Y. Wang, Y.M. Xia, Modeling of mechanical behavior of brass at high strain rates, J. Mater. Sci. Lett. 22 (2003) 1393-1394.

Google Scholar

[17] S.V. Petegem, J. Zimmermann, H. VanSwygenhoven, Yield point phenomenon during strain rate change in nanocrystalline Ni–Fe, Scrip. Mater. 65 (2011) 217-220.

DOI: 10.1016/j.scriptamat.2011.04.007

Google Scholar

[18] S. Cronje, R. E Kroon, W.D. Roos, J.H. Neethling, Twinning in copper deformed at high strain rates, Bull. Mater. Sci. 36 (2013) 157-162.

DOI: 10.1007/s12034-013-0445-4

Google Scholar