The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy

Mohd Izrul Izwan Ramli; Norainiza Saud; Mohd Arif Anuar Mohd Salleh; Mohd Nazree Derman; Rita Mohd Said; Norhayanti Nasir

doi:10.4028/www.scientific.net/MSF.819.161

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HomeMaterials Science ForumMaterials Science Forum Vol. 819The Effect of Micron-Size Silicon Additions on...

The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy

Abstract:

The effect of Si particulate addition on the commercial Sn-Cu-Ni solder system (SN100C) solder alloy has been investigated. The SN100C/Si composite solder was fabricated via powder metallurgy (PM) technique. In this study five different Si composition chosen were (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). The results indicated that adding a small amount of Si particulate can slightly improve the physical properties of the composite solder compared to monolithic solder alloy. Microstructural analysis revealed the reinforcement seen well distributed between the grains boundaries with additions of 1.0 wt. % resulted with highest hardness value.

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Periodical:

Materials Science Forum (Volume 819)

Pages:

161-166

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.819.161

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Online since:

June 2015

Authors:

Mohd Izrul Izwan Ramli*, Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Mohd Nazree Derman, Rita Mohd Said, Norhayanti Nasir

Keywords:

Composite Solder, Lead-Free, Powder metallurgy, Silicon, SN100C

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