Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

Sanjay Tikale; Mrunali Sona; K.N. Prabhu

doi:10.4028/www.scientific.net/MSF.830-831.215

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HomeMaterials Science ForumMaterials Science Forum Vols. 830-831Wettability and Bond Shear Strength of Sn-9Zn...

Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

Abstract:

Lead-free solders are environment friendly and are in great demand for microelectronic applications. In the present study, Sn-9Zn lead free solder alloy was solidified on Cu substrate for different reflow times from 10 to 1000s. The influence of reflow time on wetting, formation of intermetallic compounds (IMCs) and bond shear strength was studied using dynamic contact angle analyzer, bond tester and scanning electron microscopy. The results indicate that, the wettability of the solder alloy increased with increase in reflow time. Microstructure study revealed the presence of Cu₅Zn₈and CuZn₅ IMCs at the interface. The thickness of an IMC increased with increase in the reflow time. The mean thickness of about 11μm for Cu₅Zn₈IMC layer was observed for the reflow time of 1000s. The thickness of CuZn₅ layer increased up to a reflow time of 100s and decreases thereafter. The bond shear strength increased up to 100s and decreased with increase in reflow time. The decrement in shear strength at higher reflow time is mainly due to excessive thickness of Cu₅Zn₈IMC layer and diffusion of Sn from bulk solder towards the substrate. The excessive thick IMC layer exhibited pre micro-cracks led to the brittle failure of bond under the influence of shear stress.

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Periodical:

Materials Science Forum (Volumes 830-831)

Pages:

215-218

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.830-831.215

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Online since:

September 2015

Authors:

Sanjay Tikale, Mrunali Sona, K.N. Prabhu*

Keywords:

Bond Shear Strength, IMC, Lead-Free Solders, Reflow Time

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